• Compatible with all I2C bidirectional
datatransfer protocol
• Memory array:
2K bits (256X 8) / 4K bits (512 X 8) / 8K
bits (1024 X 8) / 16K bits (2048 X 8) ofEEPROM
Page size: 16 bytes
• Single supply voltage and high speed:
1 MHz Random and sequential Read modes
• Write:Byte Write within 3 ms
Page Write within 3 ms
Partial Page Writes Allowed
• Write Protect Pin for Hardware Data Protection
• Schmitt Trigger, Filtered Inputs for NoiseSuppression
• High-reliability
Endurance: 1 Million Write Cycles
Data Retention: 100 Years
• Enhanced ESD/Latch-up protection H B M 8 0 0 0 V
• TSOT23-5、8-lead PDIP/SOP/TSSOP and UDFNpackages

• Wide Voltage Operation
- VCC = 1.8V to 5.5V
• Operating Ambient Temperature: -40℃ to +85℃
• Internally Organized:
24C02, 256 X 8 (2K bits)
24C04, 512 X 8 (4K bits)
24C08, 1024 X 8 (8K bits)
24C16, 2048 X 8 (16K bits)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page (2K), 16-byte Page (4K, 8K, 16K) Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms max)
• High-reliability
Endurance: 1 Million Write Cycles
Data Retention: 100 Years
• 8-lead PDIP, 8-lead SOP and 8-lead TSSOP Packages
• Die Sales: Wafer Form, Waffle Pack
