4.5ns Rail to Rail, High Speed Comparator in Microsize Packages, SGM8752-1Q P2P TLV3501-Q1.
SGM8752-1Q SGM8752-1Q.pdf
FEATURES

• AEC-Q100 Qualified for Automotive Applications

  Device Temperature Grade 1

  TA = -40℃ to +125℃

• High Speed: 6.5ns Propagation Delay

• Push-Pull CMOS Output Structure

• Rail-to-Rail Input and Output

• Supply Voltage: 2.7V to 5.5V

• Low Quiescent Current: 1.8mA

• Available in a Green SOT-23-5 Package





PIN CONFIGUTION
优势替代
TLV3501-Q1 TLV3501-Q1.pdf

No.13822

FEATURES

• Qualified for Automotive Applications

  Device Temperature Grade 1: –40°C to

  125°C Ambient Operating Temperature Range

  Device HBM Classification Level 2

  Device CDM Classification Level C4B

• High Speed: 4.5 ns

• Rail-To-Rail I/O

  Supply Voltage: 2.7 V to 5.5 V

• Push-Pull CMOS Output Stage

• Shutdown

• Micro Package: SOT23-6

• Low Supply Current: 3.2 mA

• Z-Suffix Offers Improved Delamination

PIN CONFIGUTION
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